Professional Transparent LCD Screen for Anti-theft Device

General Specification：

1 FEATURES

(1) Display format : 160* 128 dot-matrix ; 1/ 128 duty.

(2) Construction : LCD, Bezel, Zebra and PCB.

(3) Optional Edge LED back-light.

(4) Controller : T6963C OR EQU.

(5) 5V single power input. Built-in DC/DC converter for LCD driving.

(6) Extended temperature type.

2 MECHANICAL DATA

Parameter	Standard Value	Unit
Dot size	0.54 (W) 0.54(H)	mm
Dot pitch	0.58(W) 0.58(H)	mm
Viewing area	101.0(W) 82.2(H)	mm
Module size (w/ LED back-light)	129.0(W) 102.0(H) 14 max (T)	mm

3 ABSOLUTE MAXIMUM RATINGS

Parameter		Symbol	Min	Max	Unit
Logic Circuit Supply Voltage		VDD-VSS	-0.3	5.0	V
LCD Driving Voltage		VDD-VO	-0.3	16.0	V
Input Voltage		VI	-0.3	VDD+0.3	V
Normal temp. type	Operating Temp.	TOP	0	50	C
	Storage Temp.	TSTG	-10	60	C
Extended temp. type	Operating Temp.	TOP	-20	70	C
	Storage Temp.	TSTG	-30	80	C

Display Image:

Application：

VA LCD PANEL Application：Automotive ，Medical。

TN LCD PANEL Application：Automotive ，Medical，Thermometer。

STN LCD PANEL Application：Electric Meter ，Elevator，Home appliance

Consumer Electronics，Watch。

BIGBOOK  Factory：

Why choose Us：

Packaging & Shipping：

Packaging: Carton boxess, Cupboard , EPE, Blister Tray, About the package way, it is up to the size of products,

according to customer request and demand. Different countries have not same requirement..

Shipping: Express way as DHL,Fedex,EMS,UPS,air shipping,sea shipping,Any shipping method you prefer.

 

Payment Method：

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TFT-LCD technology, detailed process

Working principle of TFT-LCD liquid crystal display

The manufacturing process of thin film transistor liquid crystal display has the following parts: TFT array is formed on the TFT substrate; forming a color filter pattern and ITO conductive layer on the color filter substrate; with two substrates to form a liquid crystal box installation; peripheral circuit, backlight module assembly assembly.

1. process for forming TFT array on TFT substrate

TFT has realized the industrialization of the types include: amorphous silicon TFT (a-Si TFT), polycrystalline silicon TFT (p-Si TFT), monocrystalline silicon TFT (c-Si) several. Currently the most widely used is a-Si TFT.

The fabrication process of a-Si TFT is to first sputter the gate material film on the borosilicate glass substrate, and then form the grid pattern after the mask exposure, the development and the dry etching. Step exposure machine for general mask exposure. The second step is to use PECVD method for continuous film formation, SiNx film, non doped a-Si film, phosphorus doped n+a-Si film. Then, the a-Si pattern of the TFT part is formed by mask exposure and dry etching. The third step is to form a transparent electrode (ITO film) by sputtering, and then to display the electrode pattern by mask exposure and wet etching. The contact hole pattern of the fourth step gate extreme insulation film is formed by mask exposure and dry etching method. The fifth step is to sputter AL into the film, with mask exposure, etching the source, drain and signal line pattern of TFT. Finally, the protective film is formed by PECVD method, and then the film is etched by mask exposure and dry etching. The protective film is used to protect the electrode and the electrode and the display electrode. So far, the whole process is completed.

TFT array technology is the key of TFT-LCD manufacturing process, and the most part of equipment investment. The entire process requires a high level of purification (e.g., level 10).

2. process for forming a color filter pattern on a color filter (CF) substrate

The method for forming the colored part of the color filter comprises a dye method, a pigment dispersion method, a printing method, an electrolytic deposition method and an ink-jet method. At present, the pigment dispersion method.

The first step of the pigment dispersion method is to disperse the fine particles (average particle size less than 0.1 M) (R, G, B tricolor) in the transparent photosensitive resin. Then they were coated with R., G. and B color patterns in order to be coated, exposed and developed. The device is mainly used for coating, exposure and developing.

In order to prevent light leakage, usually with a black matrix at the junction of three RGB (BM). In the past, the single layer metal chromium film was formed by sputtering method, and now there is a new type of BM film or resin mixed carbon resin BM.